Pan-Semiconductor Water Jet Coating Removal System | Non-Contact, Damage-Free Stripping

Fedjetting’s Ultra‑High Pressure Water Jet Coating Removal System delivers surgical‑precision, substrate‑safe decoating for semiconductor manufacturing. Using pure water at up to 4,000 bar, our technology removes coatings, residues, and deposited films without chemicals, abrasives, or thermal damage—protecting delicate parts while meeting the strictest cleanliness and yield requirements.

Core Value Proposition

At Fedjetting, we engineer ultra-high pressure waterjet systems to solve the most critical coating removal challenges across semiconductor, display, solar, and advanced electronics production. Our technology delivers surgical precision without compromising substrate integrity, eliminating costly damage risks and chemical dependencies.

Ultra-High Pressure Water Jet Coating Removal System for the Pan-Semiconductor Industry

This advanced system utilizes ultra-high pressure water jet technology to deliver precise, non-contact coating removal for semiconductor and electronics manufacturing. It ensures contamination-free processing, protects delicate substrates, and enhances production efficiency through customizable jet modes and automated control.

Applications

Technology Differentiation

Fedjetting’s proprietary nozzle dynamics and flow control systems enable unmatched stability for continuous operation. Our solutions integrate seamlessly with automation cells, robotics, and inline processes while delivering repeatable results batch after batch.

Customer On-Site Application Cases

Real on-site installation and operation photos of Fedjetting ultra-high pressure waterjet coating removal systems at customer facilities. Our solutions deliver reliable, residue-free, substrate-safe decoating for PVD/CVD chambers, shielding fixtures and precision components in semiconductor, display and panel manufacturing.

Why Waterjet Technology Wins:

Substrate Integrity Protection:

Pure water cutting action preserves micron-level surface tolerances critical for yield. No thermal stress or abrasive particle contamination.

Complete Process Control:

Adjustable impact energy enables removal from nanometer films to thick industrial coatings with one system.

Sustainable Operation:

Zero chemical additives reduce waste treatment costs. Water recycling options available.

Access Redefined:

Reach recessed surfaces, microscopic features, and fragile components inaccessible to mechanical tools.

Validated Cleanliness:

Achieve production-grade surface conditions ready for immediate recoating or bonding processes.

Jet Nozzle Module for Coating Removal

This module integrates ultra-high pressure water jet technology to safely and efficiently strip coatings from surfaces. It offers precise control over jet patterns and impact for targeted, non-destructive cleaning.

Rotating Jet Mode

The externally driven jet modeutilizes a high-pressure water jet nozzle driven by a servo motor, capable of reaching a maximum working pressure of 4,000 bar. Its rotational speed is adjustable steplessly from 0 to 1500 rpm.

Single-Orifice Jet Mode

The single-orifice jet modeconcentrates energy more effectively and delivers significantly greater impact force on the target object compared to multi-orifice jet modes. It is primarily used for applications involving hard surfaces and clogged obstructions.

Fan-shaped Jet Mode

The fan-shaped jet mode disperses the water stream into a flat, fan-like plane, offering a significantly wider coverage area compared to the single-orifice jet mode. It achieves much higher efficiency when cleaning larger surfaces or planar structures with regular shapes.

Customized Jet Mode

The Customized Jet Mode is a specially tailored jet solution developed by Fedjetting. It is designed based on comprehensive simulation analysis of the customer's actual application scenarios and the specific force requirements for the workpiece surface material.

Semiconductor Component Cleaning Results

Actual processing results of semiconductor chamber parts, shielding fixtures and PVD/CVD components after Fedjetting waterjet coating removal. Our non-abrasive, residue-free, substrate-safe technology ensures zero contamination, intact surface precision and full compliance with strict fab cleanliness standards.

Request Coating Removal Solution

Contact Fedjetting to discuss your substrate material, coating type, cleanliness specs, and automation needs. We deliver engineered ultra‑high pressure waterjet systems that maximize part life, lower costs, and protect your critical production components.